Author: Daisy Bennett

Plasma Treating Printed Circuit Boards and Assemblies (PCBs and PCBAs)

Plasma treatment is commonly used in the electronic industry at various stages of manufacture. Plasma etching removes physical layers, while plasma enhanced deposition adds additional layers. These plasma systems can be powerful tools, critical to the manufacture of chips and electronic components and Printed Circuit Boards. Plasma treatment is commonly used to improve adhesion, bond […]

5 Reasons to Use Plasma for the Surface Cleaning of Metals

Plasma surface cleaning using Atmospheric Plasma, Vacuum Plasma or even Corona, removes organic contaminants at a microscopic level and is typically used as a final, ultrafine cleaning process for applications requiring cleanliness at a molecular level. Plasma cleaning is done using highly charged atoms, which are shot at the surface to vaporise contamination in a […]

Polypropylene and Plasma Surface Treatment

Polypropylene (PP) is a versatile polymer widely used in various industries. However, its low surface energy can limit adhesion and bonding capabilities. Plasma surface treatment offers an effective solution to enhance polypropylene by modifying its surface properties. In this blog, Tantec UK & Ireland explore the effects of plasma surface treatment on polypropylene and its […]